CONNECTION MEMBER AND MOUNT ASSEMBLY, AND PRODUCTION METHOD OF THE SAME
PROBLEM TO BE SOLVED: To provide a connection member which can be produced without a via-forming step. SOLUTION: The connection member 100 includes: an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10a, and a side surface 10c which connects...
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| creator | ASAHI TOSHIYUKI SAITO YOSHIYUKI ICHIYANAGI TAKASHI NISHIYAMA TOSAKU SHIBATA OSAMU NAKAYAMA TAKESHI KARASHIMA YASUHARU NAKATANI SEIICHI HIRANO KOICHI |
| description | PROBLEM TO BE SOLVED: To provide a connection member which can be produced without a via-forming step. SOLUTION: The connection member 100 includes: an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10a, and a side surface 10c which connects these surfaces; and at least one wire 20 which extends from the upper surface to the lower surface through the side surface. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | CONNECTION MEMBER AND MOUNT ASSEMBLY, AND PRODUCTION METHOD OF THE SAME |
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