CONNECTION MEMBER AND MOUNT ASSEMBLY, AND PRODUCTION METHOD OF THE SAME

CONNECTION MEMBER AND MOUNT ASSEMBLY, AND PRODUCTION METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a connection member which can be produced without a via-forming step. SOLUTION: The connection member 100 includes: an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10a, and a side surface 10c which connects...

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Hauptverfasser: ASAHI TOSHIYUKI, SAITO YOSHIYUKI, ICHIYANAGI TAKASHI, NISHIYAMA TOSAKU, SHIBATA OSAMU, NAKAYAMA TAKESHI, KARASHIMA YASUHARU, NAKATANI SEIICHI, HIRANO KOICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a connection member which can be produced without a via-forming step. SOLUTION: The connection member 100 includes: an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10a, and a side surface 10c which connects these surfaces; and at least one wire 20 which extends from the upper surface to the lower surface through the side surface. COPYRIGHT: (C)2006,JPO&NCIPI