ELECTROLESS COPPER PLATING SOLUTION, AND ELECTROLESS COPPER PLATING METHOD

PROBLEM TO BE SOLVED: To provide an electroless copper plating solution which can be processed simply at the time of disposal, and can sufficiently reduce the burden on the biological environment or the like. SOLUTION: In the electroless copper plating solution containing a reducing agent for reduci...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIIKE JUN, TAKENOUCHI TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroless copper plating solution which can be processed simply at the time of disposal, and can sufficiently reduce the burden on the biological environment or the like. SOLUTION: In the electroless copper plating solution containing a reducing agent for reducing copper ions and depositing copper on a surface of an object to be plated which is immersed in a solution with copper ions eluted therein, alkaline electrolytic water obtained by electrolyzing aqueous solution with sodium ascorbate dissolved therein is used as the reducing agent. COPYRIGHT: (C)2006,JPO&NCIPI