CURRENT CONTROL METHOD FOR CONTINUOUS PLATING DEVICE OF CARRIER SYSTEM

PROBLEM TO BE SOLVED: To provide a current control method for a continuous plating device of a carrier system where the parts to be thickly plated in the tip parts or tail parts in works are reduced, the damage of a seal roller and product works caused by thickened plating is reduced, and the platin...

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Bibliographische Detailangaben
Hauptverfasser: HOTTA HIROMITSU, YOSHIDA KENJI, OSADA NORIYO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a current control method for a continuous plating device of a carrier system where the parts to be thickly plated in the tip parts or tail parts in works are reduced, the damage of a seal roller and product works caused by thickened plating is reduced, and the plating film thickness in the product works is made uniform even if dummy works are short. SOLUTION: In the current control method for the continuous plating device of a carrier system which is used for cotrolling plating current when works W are subjected to batch type treatment, the length of the works W corresponding to each anode 2a, 2b, 3a, 3b, 4a, 4b, 5a, 5b, 6a, 6b is obtained, the length of the works W is divided by the length of each anode 2a, 2b, 3a, 3b, 4a, 4b, 5a, 5b, 6a, 6b to obtain the ratio of the length of the works to the length of the anodes, and, with the value obtained by multiplying the set current value by the ratio as the standard value, power devices 7a, 7b, 8a, 8b, 9a, 9b, 10a, 10b, 11a, 11b are controlled. COPYRIGHT: (C)2006,JPO&NCIPI