METHOD FOR MAKING OPENING IN SUBSTRATE
PROBLEM TO BE SOLVED: To provide a method for making openings (1) of a predetermined position in a substrate (2) that is in the form of a printing template by using a laser. SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done,...
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| creator | WENKE STEPHAN |
| description | PROBLEM TO BE SOLVED: To provide a method for making openings (1) of a predetermined position in a substrate (2) that is in the form of a printing template by using a laser. SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done, local displacement of the openings (1) resulting from subsequent steps in the process, and which lead to a change in the tension state of the substrate (2), are avoided because the coordinates of a central reference point (4) are determined first. The particular distance (a) from each predetermined positions of the openings (1) to this reference point (4) is then determined and a priority (5) is formed therefrom. The priority (5) then forms the basis for a processing program (6) by which the path followed by the laser head is controlled and the openings (1) are positioned in the substrate (2). COPYRIGHT: (C)2006,JPO&NCIPI |
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SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done, local displacement of the openings (1) resulting from subsequent steps in the process, and which lead to a change in the tension state of the substrate (2), are avoided because the coordinates of a central reference point (4) are determined first. The particular distance (a) from each predetermined positions of the openings (1) to this reference point (4) is then determined and a priority (5) is formed therefrom. The priority (5) then forms the basis for a processing program (6) by which the path followed by the laser head is controlled and the openings (1) are positioned in the substrate (2). 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR MAKING OPENING IN SUBSTRATE |
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