METHOD FOR MAKING OPENING IN SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for making openings (1) of a predetermined position in a substrate (2) that is in the form of a printing template by using a laser. SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done,...

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Bibliographische Detailangaben
1. Verfasser: WENKE STEPHAN
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for making openings (1) of a predetermined position in a substrate (2) that is in the form of a printing template by using a laser. SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done, local displacement of the openings (1) resulting from subsequent steps in the process, and which lead to a change in the tension state of the substrate (2), are avoided because the coordinates of a central reference point (4) are determined first. The particular distance (a) from each predetermined positions of the openings (1) to this reference point (4) is then determined and a priority (5) is formed therefrom. The priority (5) then forms the basis for a processing program (6) by which the path followed by the laser head is controlled and the openings (1) are positioned in the substrate (2). COPYRIGHT: (C)2006,JPO&NCIPI