METHOD FOR MAKING OPENING IN SUBSTRATE
PROBLEM TO BE SOLVED: To provide a method for making openings (1) of a predetermined position in a substrate (2) that is in the form of a printing template by using a laser. SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done,...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for making openings (1) of a predetermined position in a substrate (2) that is in the form of a printing template by using a laser. SOLUTION: To this end, the substrate (2) is positioned by fixing means (3) in the form of a clamping frame. When this is done, local displacement of the openings (1) resulting from subsequent steps in the process, and which lead to a change in the tension state of the substrate (2), are avoided because the coordinates of a central reference point (4) are determined first. The particular distance (a) from each predetermined positions of the openings (1) to this reference point (4) is then determined and a priority (5) is formed therefrom. The priority (5) then forms the basis for a processing program (6) by which the path followed by the laser head is controlled and the openings (1) are positioned in the substrate (2). COPYRIGHT: (C)2006,JPO&NCIPI |
---|