RESIN SEALING DEVICE

PROBLEM TO BE SOLVED: To provide a sealing device which enables a resin molded product to be thinned and formed with a constant thickness. SOLUTION: A cavity is formed with a cavity block 1, a clamper 2, and a lower die 3; and an overflow gate 8 is formed in the clamper 2 so as to be contiguous to the cavity. A relief piston 7 is provided in the clamper 2 so as to be contiguous to the overflow gate 8, and a sub-runner 11 is formed around the lower face of the cavity block 1. A board 5 mounting a plurality of semiconductor elements 4 thereon is set in the cavity, and a resin tablet 6 is set on the plurality of semiconductor elements 4. The board 5 is clamped by the clamper 2, and the cavity block 1 is pressured and heated, whereby a resin is melted and spread to a circumference of the cavity. The remainder of the spread resin is discharged from the sub-runner 11 to the relief piston 7 through the overflow gate 8. COPYRIGHT: (C)2006,JPO&NCIPI