SEMICONDUCTOR MANUFACTURING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of enhancing the reliability of a semiconductor device. SOLUTION: A mold device 1 is configured such that a unit 2 constituting a production mechanism is accommodated in a cabinet, and the cabinet is covered with a plur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: OSAKA SHINGO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of enhancing the reliability of a semiconductor device. SOLUTION: A mold device 1 is configured such that a unit 2 constituting a production mechanism is accommodated in a cabinet, and the cabinet is covered with a plurality of covers 4. The plurality of covers 4 comprise a window 7 for inspecting the unit 2 and for confirming the occurrence of contaminants in the device, and an outer frame 6 for fixing the window 7. An acrylic resin of a transparent material is used for the window 7, and a SUS is used for the outer frame 6. COPYRIGHT: (C)2006,JPO&NCIPI