PLATING METHOD AND PLATING DEVICE

PROBLEM TO BE SOLVED: To improve the yield at the time of performing continuous plating treatment to a plurality of wafers. SOLUTION: Wafers are conveyed from a loader part 2 to a pre-treatment part 3, so as to be pre-treated, are thereafter conveyed to plating tank parts 5A to 5D, so as to be plating-treated, and are further conveyed to a post-treatment part 6, so as to be post-treated. At the time when loader overtime is generated at the loader part 2, the wafers to which the pre-treatment has been completed are recovered and conveyed to the plating tank parts 5A to 5D, and further, the wafers to which the plating treatment has been completed are recovered and conveyed to the post-treatment part 6. In this way, even at the time when loader overtime is generated at the loader part 2 during the continuous plating treatment to the wafers, ordinary treatment is continued to the wafers which have been already transferred to the plating stage or plating preparation stage, so as to be finished products. COPYRIGHT: (C)2006,JPO&NCIPI