ADHESIVE COMPOSITION, MULTILAYER PRINTED WIRING BOARD USING THE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide an adhesive composition easy to adjust its resin flow, to provide a multilayer printed wiring board reduced in resin intrusion into a cavity by using the adhesive composition, and to provide a method for producing the multilayer printed wiring board. SOLUTION: The ad...

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Bibliographische Detailangaben
Hauptverfasser:	NEGISHI HARUMI, KAMOSHITA SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive composition easy to adjust its resin flow, to provide a multilayer printed wiring board reduced in resin intrusion into a cavity by using the adhesive composition, and to provide a method for producing the multilayer printed wiring board. SOLUTION: The adhesive composition essentially consists of a thermoplastic resin, a high-molecular-weight polyphenylene ether resin having a number-average molecular weight of 80,000 to 120,000 and obtained by the polycondensation of at least one monocyclic phenol, and an elastomer with a main chain in which part of the structural units are crosslinked. The multilayer printed wiring board is prepared by using the adhesive composition to bond constituent boards. The method for producing the multilayer printed wiring board comprises using the adhesive composition as a varnish, applying the varnish to bonding surfaces of constituent boards, drying the boards, and applying heat and pressure to them. COPYRIGHT: (C)2006,JPO&NCIPI