FUNCTIONAL ELECTROCONDUCTIVE COATING, ELECTRONIC CIRCUIT USING THE SAME AND ITS FORMATION METHOD
PROBLEM TO BE SOLVED: To provide a low-temperature-curing electroconductive coating which shows high adhesion to a resin substrate or copper foil, shows good electroconductivity and is solderable, and to provide an inexpensive, environmentally friendly functional electroconductive coating which enab...
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| creator | YANO KATSUMI TSUNOSAKI MASAHIRO YOSHIDA SHINOBU FUJISHIRO TOSHIFUMI TERASAWA TAKASHI YAMAMICHI YUJI |
| description | PROBLEM TO BE SOLVED: To provide a low-temperature-curing electroconductive coating which shows high adhesion to a resin substrate or copper foil, shows good electroconductivity and is solderable, and to provide an inexpensive, environmentally friendly functional electroconductive coating which enables simplification of a circuit manufacturing step and does not produce any waste liquid by etching, an electronic circuit using the same and its formation method. SOLUTION: The functional electroconductive coating contains a metal powder, a binder, an unsaturated fatty acid and an organic solvent, wherein the metal powder is an Ag-coated Ni powder and an Ag powder, wherein the Ag content in the Ag-coated Ni powder is 5-20 wt.%. The compounding ratio of the Ag-coated Ni powder and the Ag powder is preferably (100-50):(0-50) by weight. The binder contains a thermosetting resin, the unsaturated fatty acid is oleic acid, and the organic solvent is butyl carbitol. COPYRIGHT: (C)2006,JPO&NCIPI |
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SOLUTION: The functional electroconductive coating contains a metal powder, a binder, an unsaturated fatty acid and an organic solvent, wherein the metal powder is an Ag-coated Ni powder and an Ag powder, wherein the Ag content in the Ag-coated Ni powder is 5-20 wt.%. The compounding ratio of the Ag-coated Ni powder and the Ag powder is preferably (100-50):(0-50) by weight. The binder contains a thermosetting resin, the unsaturated fatty acid is oleic acid, and the organic solvent is butyl carbitol. 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SOLUTION: The functional electroconductive coating contains a metal powder, a binder, an unsaturated fatty acid and an organic solvent, wherein the metal powder is an Ag-coated Ni powder and an Ag powder, wherein the Ag content in the Ag-coated Ni powder is 5-20 wt.%. The compounding ratio of the Ag-coated Ni powder and the Ag powder is preferably (100-50):(0-50) by weight. The binder contains a thermosetting resin, the unsaturated fatty acid is oleic acid, and the organic solvent is butyl carbitol. 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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | FUNCTIONAL ELECTROCONDUCTIVE COATING, ELECTRONIC CIRCUIT USING THE SAME AND ITS FORMATION METHOD |
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