FUNCTIONAL ELECTROCONDUCTIVE COATING, ELECTRONIC CIRCUIT USING THE SAME AND ITS FORMATION METHOD

PROBLEM TO BE SOLVED: To provide a low-temperature-curing electroconductive coating which shows high adhesion to a resin substrate or copper foil, shows good electroconductivity and is solderable, and to provide an inexpensive, environmentally friendly functional electroconductive coating which enables simplification of a circuit manufacturing step and does not produce any waste liquid by etching, an electronic circuit using the same and its formation method. SOLUTION: The functional electroconductive coating contains a metal powder, a binder, an unsaturated fatty acid and an organic solvent, wherein the metal powder is an Ag-coated Ni powder and an Ag powder, wherein the Ag content in the Ag-coated Ni powder is 5-20 wt.%. The compounding ratio of the Ag-coated Ni powder and the Ag powder is preferably (100-50):(0-50) by weight. The binder contains a thermosetting resin, the unsaturated fatty acid is oleic acid, and the organic solvent is butyl carbitol. COPYRIGHT: (C)2006,JPO&NCIPI