DRESSING DEVICE FOR GRINDING WHEEL

PROBLEM TO BE SOLVED: To provide an in-process dressing device in a silicon wafer grinding apparatus, which dressing device can improve the property of a machined surface of the wafer without using an expensive apparatus. SOLUTION: A dressing plate 10 is arranged via a clearance 11 on an annular abrasive grain surface 13 located in a separated position 9 separated from the grinding point 2 of an annular abrasive grain surface 4 of a disk shape grinding wheel for grinding a workpiece 1. An ice-making apparatus 14 is connected to the dressing plate 10. The ice surface 16 is continuously formed in the clearance 11 between the upper surface of the dressing plate 10 and the annular abrasive grain surface 13 located in the separated position 9, because the water 15 supplied from a nozzle 12 freezes. The annular abrasive grain surface 13 located in the separated position 9 grinds the ice surface 16 while grinding the workpiece 1 by bringing the ice surface 16 formed on the dressing plate 10 into contact with the annular abrasive grain surface 13 located in the separated position 9. As a result, the dressing and cleaning of the grinding wheel is carried out. COPYRIGHT: (C)2006,JPO&NCIPI