SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To manufacture an RF module having multiple functions at a low cost, relating to the technology which is effectively applied to manufacturing of an RF (radio frequency) module used for digital portable telephones. SOLUTION: The manufacturing method arranges a first circuit bloc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ITO MAMORU, YOSHIOKA FUMITAKA, ONO HIROSHI, NIITSU TOSHIJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To manufacture an RF module having multiple functions at a low cost, relating to the technology which is effectively applied to manufacturing of an RF (radio frequency) module used for digital portable telephones. SOLUTION: The manufacturing method arranges a first circuit block MB1 comprising a first laminated board 10 having five layers ((n+m) layers) where an RF power module is formed, and a second circuit block MB2 comprising a second laminated board 17 having different number of layers from that of the first laminated board 10, 11 layers (k layer), where a front end module is formed. The second laminated board 17 is incorporated in the first laminated board 10 to constitute a single multifunction RF module MRF1, consisting of the first circuit block MB1 formed at the first laminated board 10 and the second circuit block MB2 formed at the second laminated board 17. When changes in the specification are required with the front end module formed at the second circuit block MB2, for example, the specifications of the multifunction RF module MRF1 are changed by replacing the second laminated board 17. COPYRIGHT: (C)2006,JPO&NCIPI