FLEXIBLE PRINTED BOARD FOR MOUNTING COMPONENT AND ITS MOUNTING METHOD

PROBLEM TO BE SOLVED: To highly densely place an IC chip and a surface-mounted component on a flexible printed board. SOLUTION: The IC chip is mounted on one of surfaces of a single flexible printed board including a conductor formed in a circuit pattern while electrically connected with the conduct...

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Bibliographische Detailangaben
1. Verfasser:	MURAOKA SEIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To highly densely place an IC chip and a surface-mounted component on a flexible printed board. SOLUTION: The IC chip is mounted on one of surfaces of a single flexible printed board including a conductor formed in a circuit pattern while electrically connected with the conductor via a conductive adhesive film. On the other hand, the surface mounted component other than the IC chip is mounted while electrically connected with the conductor by means of reflow soldering on the other surface including the rear face of the mounted position of the IC chip. The flexible printed board includes a conductor formed in the circuit pattern on both surfaces of a single insulation resin layer, having the IC chip mounted on the conductor on one of the surfaces, and having the surface mounted component other than the IC chip mounted on the conductor on the other surface. COPYRIGHT: (C)2006,JPO&NCIPI