COIL DEVICE

PROBLEM TO BE SOLVED: To improve heat dissipation by spreading a surface area while maintaining the size of a square shape core. SOLUTION: A coil device coil 3 consists of a rectangular line 2, and the square shape core 10 burying the center of the coil 3 and surrounding the periphery of the coil 3....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YOSHIMOTO NORIYUKI, HIROSE KAZUHISA, TERAMOTO NAOKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve heat dissipation by spreading a surface area while maintaining the size of a square shape core. SOLUTION: A coil device coil 3 consists of a rectangular line 2, and the square shape core 10 burying the center of the coil 3 and surrounding the periphery of the coil 3. Triangular pillar shape irregularities 11 are formed on the whole of four side surfaces to earn the surface area. COPYRIGHT: (C)2006,JPO&NCIPI