MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To provide a member for a semiconductor manufacturing apparatus easy to obtain anchoring effects and reduced in the number of particles. SOLUTION: The member for the semiconductor manufacturing apparatus incorporated in the semiconductor manufacturing apparatus for processing a...

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Bibliographische Detailangaben
Hauptverfasser:	YOKOYAMA MASARU, KOBAYASHI YOSHIAKI, ICHIJIMA MASAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA METALLURGY REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a member for a semiconductor manufacturing apparatus easy to obtain anchoring effects and reduced in the number of particles. SOLUTION: The member for the semiconductor manufacturing apparatus incorporated in the semiconductor manufacturing apparatus for processing a semiconductor wafer is made of a porous alumina substrate with a surface layer having a porosity of 20-60% and the depth of a pore of 10-100 μm. COPYRIGHT: (C)2006,JPO&NCIPI