PRINTED WIRING BOARD, MANUFACTURING METHOD AND SOLDERING METHOD THEREFOR AND INFORMATION PROCESSING APPARATUS USING IT

PROBLEM TO BE SOLVED: To improve the soldering quality in a through hole when the partial region of a printed wiring board is covered with a nozzle and soldering is carried out by overheating that region with dissolved solder. SOLUTION: A note PC 20 comprises a glass epoxy resin board 1a wherein through-holes 4, 13 are formed and metal-plated for electric conduction between the sheets of copper foil 2a, 2b disposed on the front and rear surfaces respectively, a terminal pad 12b for soldering a lead 6 inserted into the through-hole 13 from the front surface which pad 12b is laminated on the copper foil 2b on the glass epoxy resin board 1a and including the through-hole 13, and a heat conduction pad 10 for conducting heat to the through-hole 13 via the copper foil 2b on the rear surface which pad 10 being laminated on the copper foil 2b on the rear surface separately from the terminal pad 12b. COPYRIGHT: (C)2006,JPO&NCIPI