MEMBER FOR CIRCUIT BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a circuit board or a member for the circuit board laminating a flexible film to a reinforcing plate through an organic matter layer, forming a circuit pattern having a high accuracy by maintaining a dimensional accuracy, and being capable of connecting an IC at a fin...

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Bibliographische Detailangaben
Hauptverfasser:	FUJI NOBUO, AKAMATSU TAKAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a circuit board or a member for the circuit board laminating a flexible film to a reinforcing plate through an organic matter layer, forming a circuit pattern having a high accuracy by maintaining a dimensional accuracy, and being capable of connecting an IC at a fine bump-pitch by making the bump-height of the IC lower than the present condition. SOLUTION: In the member for the circuit board, the reinforcing plate, the organic matter layer, the flexible film and a metallic layer are laminated in the order. In the member for the circuit board, the metallic layer is formed in the pattern of a 30 μm pitch or less, and a projecting section having a height from 1 μm to 50 μm is formed to the metallic surface of the obtained wiring pattern. COPYRIGHT: (C)2006,JPO&NCIPI