PASTE FOR CHARGE AND PASTE CHARGE METHOD
PROBLEM TO BE SOLVED: To provide a paste for charge for filling up efficiency good which is stabilized and can be filled up with paste even if it is the case that a small diameter hole formed in a printed circuit board, such as a through-hole and a blind via hole, etc. are fine or that an aspect rat...
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creator | NOGAMI TAKAMASA KOKUNI TAKASHI |
description | PROBLEM TO BE SOLVED: To provide a paste for charge for filling up efficiency good which is stabilized and can be filled up with paste even if it is the case that a small diameter hole formed in a printed circuit board, such as a through-hole and a blind via hole, etc. are fine or that an aspect ratio is large, and to provide a paste charge method. SOLUTION: In the paste for the charge for filling up the small diameter hole, such as the through hole, the blind via hole, etc. formed in a printed circuit board, a viscosity-shear rate characteristic falls within the following formula. The inequality logY>-0.67logX+2.53 and logY |
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SOLUTION: In the paste for the charge for filling up the small diameter hole, such as the through hole, the blind via hole, etc. formed in a printed circuit board, a viscosity-shear rate characteristic falls within the following formula. The inequality logY>-0.67logX+2.53 and logY<-0.62logX+3.18. Here, in the formula, Y expresses the viscosity of the paste for the charge [Pa s], X expresses the shear rate [1/s] of the paste for the charge. Moreover, a printer P having a squeegee 4 is used, the attack angle θ1of the squeegee 4 in an initial printing performance is set to 3-18°, a sweep speed is set to 1-30 mm/s, and the charge of the paste 1 for the charge is performed. 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SOLUTION: In the paste for the charge for filling up the small diameter hole, such as the through hole, the blind via hole, etc. formed in a printed circuit board, a viscosity-shear rate characteristic falls within the following formula. The inequality logY>-0.67logX+2.53 and logY<-0.62logX+3.18. Here, in the formula, Y expresses the viscosity of the paste for the charge [Pa s], X expresses the shear rate [1/s] of the paste for the charge. Moreover, a printer P having a squeegee 4 is used, the attack angle θ1of the squeegee 4 in an initial printing performance is set to 3-18°, a sweep speed is set to 1-30 mm/s, and the charge of the paste 1 for the charge is performed. 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SOLUTION: In the paste for the charge for filling up the small diameter hole, such as the through hole, the blind via hole, etc. formed in a printed circuit board, a viscosity-shear rate characteristic falls within the following formula. The inequality logY>-0.67logX+2.53 and logY<-0.62logX+3.18. Here, in the formula, Y expresses the viscosity of the paste for the charge [Pa s], X expresses the shear rate [1/s] of the paste for the charge. Moreover, a printer P having a squeegee 4 is used, the attack angle θ1of the squeegee 4 in an initial printing performance is set to 3-18°, a sweep speed is set to 1-30 mm/s, and the charge of the paste 1 for the charge is performed. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | PASTE FOR CHARGE AND PASTE CHARGE METHOD |
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