PASTE FOR CHARGE AND PASTE CHARGE METHOD

PROBLEM TO BE SOLVED: To provide a paste for charge for filling up efficiency good which is stabilized and can be filled up with paste even if it is the case that a small diameter hole formed in a printed circuit board, such as a through-hole and a blind via hole, etc. are fine or that an aspect rat...

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Bibliographische Detailangaben
Hauptverfasser:	NOGAMI TAKAMASA, KOKUNI TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a paste for charge for filling up efficiency good which is stabilized and can be filled up with paste even if it is the case that a small diameter hole formed in a printed circuit board, such as a through-hole and a blind via hole, etc. are fine or that an aspect ratio is large, and to provide a paste charge method. SOLUTION: In the paste for the charge for filling up the small diameter hole, such as the through hole, the blind via hole, etc. formed in a printed circuit board, a viscosity-shear rate characteristic falls within the following formula. The inequality logY>-0.67logX+2.53 and logY