ETCHING METHOD AND ETCHING APPARATUS FOR CATHODE ELECTRODE DEVICE IN PLATING EQUIPMENT

PROBLEM TO BE SOLVED: To safely and efficiently remove a plating film formed on an electrode assembly in a cathode electrode device used in plating equipment for a wafer or a substrate. SOLUTION: The subject etching apparatus 2 is used for an electrode 15 provided on the other end of a cathode holder 11 composed of a cylindrical body 111 and having a first projection 113 extending to the outside almost vertically to the axis of the cylindrical body 111 along at least a part of the outer circumferential part of one end of the cylindrical body 111, and forming the cathode of the plating equipment and is provided with an etching vessel 20 provided with a bottom board 23, a side wall 21 extending almost vertically to the bottom board 23 and also around the surface of the bottom board 23, and a second projection 22 extending to the inside along at least a part of the tip of the side wall 21, and having an opening into which the cylindrical body 111 can be inserted. The side wall 21 has a height to produce a gap X between the electrode 15 and the bottom board 23 at the time when the first projection 113 is placed on the second projection 22 in a direction where the electrode 15 and the bottom board 23 are confronted. COPYRIGHT: (C)2006,JPO&NCIPI