EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which hardly generates a leakage electric current even in a semiconductor having a narrow wired line width, has high dielectric constant characteristics, and has good moldability. SOLUTION: This epoxy resin composition for sealing semicondu...

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Bibliographische Detailangaben
1. Verfasser:	SAKUMICHI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition which hardly generates a leakage electric current even in a semiconductor having a narrow wired line width, has high dielectric constant characteristics, and has good moldability. SOLUTION: This epoxy resin composition for sealing semiconductors is characterized by comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) barium titanate containing 1 to 10 wt.% of neodymium oxide as essential components. The content of the barium titanate containing the neodymium oxide is preferably 75 to 95 wt.% based on the total amount of the epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI