POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT COMPRISING THE COMPOSITION

PROBLEM TO BE SOLVED: To provide an polyamide resin composition compounded with inorganic fillers or pigments in a polyamide resin at a high concentration but nevertheless having excellent fluidity and good moldability. SOLUTION: The polyamide resin composition comprises (A) a polyamide resin, (B) a...

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Hauptverfasser:	MIYAO SATOSHI, TANAKA KATSUNORI, KAMIKADO NOBUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an polyamide resin composition compounded with inorganic fillers or pigments in a polyamide resin at a high concentration but nevertheless having excellent fluidity and good moldability. SOLUTION: The polyamide resin composition comprises (A) a polyamide resin, (B) an inorganic filler and/or a pigment, and (C) an amino alcohol represented by general formula (1). [Wherein, n is an integer of 0-5; and R1to R5are one selected from a group consisting of H, CH2CH2OH and CH2CH(CH3)OH, and at least one of them is CH2CH2OH or CH2CH(CH3)OH]. COPYRIGHT: (C)2006,JPO&NCIPI