WIRING BOARD

PROBLEM TO BE SOLVED: To improve the EMI noise characteristics by suppressing reduction in a wiring density and shortening a return path. SOLUTION: Elements 2 and 3, a signal pattern 4 for connecting the elements 2 and 3 together, and an inserted component such as a DIP connector (DIP switch) etc. are mounted on a board 1. The inserted component 5 is mounted on the board 1 in an edge part thereof. The return path 6 is formed directly under the signal pattern 4. The part wherein the inserted component 5 is to be mounted is a wiring disabled region wherein the wiring cannot be performed, and is a no pattern part 7 without a ground (GND) pattern and a VCC (power supply voltage) pattern. This no pattern part 7 is formed on the board 1 in the edge part thereof. COPYRIGHT: (C)2006,JPO&NCIPI