MULTI-LAYERED PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multi-layered printed wiring board such that all products can be inspected with high precision about whether or not a void is generated without breaking the multi-layered printed wiring board. SOLUTION: The multi-layered printed wiring board (1) is formed by lamina...

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Bibliographische Detailangaben
Hauptverfasser:	MORIOKA KAZUNOBU, ONO KENTARO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multi-layered printed wiring board such that all products can be inspected with high precision about whether or not a void is generated without breaking the multi-layered printed wiring board. SOLUTION: The multi-layered printed wiring board (1) is formed by laminating an internal layer circuit board (4) between two outermost layer copper foils across prepregs in one body, the multi-layered printed wiring board having a closed circuit as a test pattern (6) outside a circuit formation region (5) of the inner circuit board (4). COPYRIGHT: (C)2006,JPO&NCIPI