METHOD FOR CURING THERMOSETTING RESIN

PROBLEM TO BE SOLVED: To provide a method for curing a thermosetting resin by which the generation of a volatile organic chemical such as formaldehyde at curing is suppressed, and the remaining amount of a monomer such as styrene in a cured product is reduced. SOLUTION: The method for curing the the...

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Hauptverfasser:	ICHIKAWA HIDEJI, KOJIMA TATSUIE, NISHIKAWA TORU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for curing a thermosetting resin by which the generation of a volatile organic chemical such as formaldehyde at curing is suppressed, and the remaining amount of a monomer such as styrene in a cured product is reduced. SOLUTION: The method for curing the thermosetting resin comprises adding 1-10 pts. wt. organic peroxide comprising 55-95 pts. wt. acetylacetone peroxide and 5-45 pts. wt. peroxy ester to 100 pts. wt. thermosetting resin, and curing the added product. COPYRIGHT: (C)2006,JPO&NCIPI