SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device preventing the disconnection and short circuit of a wire. SOLUTION: A semiconductor chip 3 is mounted on a substrate 1 through a radiating board 2, and an external electrode 4 is arranged on the substrate 1. An electrode pad that is formed on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ONISHI HIROYUKI, IIDA SUMIKO, ISHIKAWA JUN, AKAGAWA KOICHI, NAGASE TOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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