SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device preventing the disconnection and short circuit of a wire. SOLUTION: A semiconductor chip 3 is mounted on a substrate 1 through a radiating board 2, and an external electrode 4 is arranged on the substrate 1. An electrode pad that is formed on the surface of the semiconductor chip 3 is connected with the external electrode 4 through a wire 5. In a region between the electrode pad of the semiconductor chip 3 and the wire bonding part of the external electrode 4, a rubber-like insulating member 7 is projected and formed on the corner 6 of the radiating board 2 located at the lower part of the wire 5. Even if the wire 5 is moved owing to the oscillation or the like from the outside, the direct contact of the wire 5 with the corner 6 of the radiating board 2 is prevented by the contact of the wire 5 with the insulating member 7. COPYRIGHT: (C)2006,JPO&NCIPI