CLAMP MEMBER, FILM FORMING DEVICE, FILM FORMING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a clamp member surely unclamping a substrate by simple structure, a film forming device using the clamp member, a film forming method, and a method for manufacturing a semiconductor device. SOLUTION: A clamp ring 15 for holding a wafer 11 when processing the wafer 11 is provided with an inner peripheral side flange 3, a rotary shaft 22 arranged on the inner peripheral side flange 3, and a rotary member 21. The rotary member 21 is rotated around the rotary shaft 22 and has a tip 26 and a rear end 27. The rotary member 21 is arranged so that the tip 26 is located on a position which is overlapped to the part of the wafer 11 through an interval when the inner peripheral flange 3 holds the wafer 11. When the rotary member 21 is rotated around the rotary shaft 22 by depressing the rear end 27 to the inner peripheral side flange 3, the tip 26 is depressed to a direction in which a part of the wafer 11 is separated from the inner peripheral side flange 3. COPYRIGHT: (C)2006,JPO&NCIPI