SURFACE MOUNTING SAW DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To make a metal film more than required at an intersection of dicing line located between SAW chips not to be deposited at the same time of blocking a gap between the skirt of each SAW chip and a substrate surface with sufficient amount of metal, when a metal film is deposited by a dry plating method on a plurality of rows of the SAW chips on a packaging substrate matrix. SOLUTION: In the depositing process of the metal film 20 by the dry plating method, the approaching angle of a metal atom evaporated from a deposition source 40 at the time of straightly advancing and adhering to a plurality of SAW chips 15 on the packaging substrate matrix 30 is set, in the condition that the metal atomic weight adhering to the intersection of longitudinal and lateral dicing lines 31x, 31y existing between the SAW chips carried on the packaging substrate matrix surface and its vicinity becomes zero or the metal film thickness is 1 μm or less. COPYRIGHT: (C)2006,JPO&NCIPI