PART PUSH-UP APPARATUS AND METHOD, AND PART MOUNTING UNIT

PART PUSH-UP APPARATUS AND METHOD, AND PART MOUNTING UNIT

PROBLEM TO BE SOLVED: To provide a method for delaminating a semiconductor chip from a wafer sheet in a reliable way without faulty delamination or damage. SOLUTION: The part push-up unit 20 has a plurality of push-up pins 56 whose base sides are fixed to a common pin fixing section 87, and the pins...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NARITA MASACHIKA, SHIDA SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for delaminating a semiconductor chip from a wafer sheet in a reliable way without faulty delamination or damage. SOLUTION: The part push-up unit 20 has a plurality of push-up pins 56 whose base sides are fixed to a common pin fixing section 87, and the pins 56 include at least one set different from the rest in terms of the tip position H in the vertical direction. It also has an elevating mechanism 95 for raising and lowering the pin fixing section 87. COPYRIGHT: (C)2006,JPO&NCIPI