SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device capable of preventing the film peeling of an interlayer film and preventing a fault due to it. SOLUTION: The semiconductor integrated circuit device comprises a semiconductor chip provided with the interlayer film, and an ins...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUZUKI KAZUMA, KAWAKAMI MASAYUKI, INODO HIDEKAZU, KIKKO HIDEYOSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device capable of preventing the film peeling of an interlayer film and preventing a fault due to it. SOLUTION: The semiconductor integrated circuit device comprises a semiconductor chip provided with the interlayer film, and an insulating film formed on the outer side of wiring provided inside the semiconductor chip and formed so as to cover the boundary of the interlayer film and the upper layer of the interlayer film, the boundary of the interlayer film and the lower layer of the interlayer film or the surface of a part where the interlayer film is removed. COPYRIGHT: (C)2006,JPO&NCIPI