MANUFACTURING METHOD OF ELECTRONIC COMPONENT SEAL AND ELECTRONIC COMPONENT SEAL

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component seal which can seal in a state of high vacuum by preventing gas from being enclosed inside a vessel, and improve manufacturing efficiency. SOLUTION: After forming a non-welding portion by a first welding process step...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIKAWA KEISUKE, HIRATSUKA HARUYUKI, WADA TOMOHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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