MANUFACTURING METHOD OF ELECTRONIC COMPONENT SEAL AND ELECTRONIC COMPONENT SEAL

MANUFACTURING METHOD OF ELECTRONIC COMPONENT SEAL AND ELECTRONIC COMPONENT SEAL

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component seal which can seal in a state of high vacuum by preventing gas from being enclosed inside a vessel, and improve manufacturing efficiency. SOLUTION: After forming a non-welding portion by a first welding process step...

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Bibliographische Detailangaben
Hauptverfasser: KIKAWA KEISUKE, HIRATSUKA HARUYUKI, WADA TOMOHISA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component seal which can seal in a state of high vacuum by preventing gas from being enclosed inside a vessel, and improve manufacturing efficiency. SOLUTION: After forming a non-welding portion by a first welding process step S203 constituted by a first beam irradiating process step S203a and a second beam irradiating process step S203b, in an anneal treating process step S204, an anneal treatment is performed by irradiating a designated portion on a locus of the electron beam, which has been formed in the first beam irradiating process step S203a, with the electron beam. COPYRIGHT: (C)2006,JPO&NCIPI