METHOD FOR MARKING DEFECTIVE POINT OF COMPONENT, MULTIPLE-PATTERNED WIRING BOARD, AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a method for marking defective point of component which does not result in deterioration of manufacturing yield due to generation of secondary defect and ensures excellent flexibility. SOLUTION: The marking method is capable of giving a marking to the defective point...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA SHIGEHIRO, KAWASE KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for marking defective point of component which does not result in deterioration of manufacturing yield due to generation of secondary defect and ensures excellent flexibility. SOLUTION: The marking method is capable of giving a marking to the defective point of a component 11 including a conductive part 17 on the base material 12. In more concrete, the conductive part 17 of the component 11 including a defective point is irradiated with energy beam to change the color of the surface of conductive part 17. As the energy beam, the laser beam is most suitable. COPYRIGHT: (C)2006,JPO&NCIPI