MOUNTING METHOD OF ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND METAL MASK

PROBLEM TO BE SOLVED: To suppress generation of soldering balls due to reflow process. SOLUTION: A mounting method of electronic components for soldering an electronic component 1 comprises a step of arranging a metal mask 13, where a set of openings 12 are provided corresponding to a set of lands 14 of printed-wiring boards 15 onto which each electrode 2 of the electronic component 1 is mounted, and end sides facing each other at each opening 12 are formed in a triangular home plate shape onto the printed-wiring board 15; a step for filling the opening 12 with Sn-Zn-based solder paste which does not contain Pb; a step of removing the metal mask 13 from the printed-wiring board 15; a step of mounting the electronic component 1 onto the printed-wiring board 15 by allowing the electrode 2 of the electronic component 1 to come into contact with the solder paste; and a step of soldering the electronic component 1 by reflow. COPYRIGHT: (C)2006,JPO&NCIPI