COMPONENT BUILT-IN TYPE MULTILAYER BOARD

PROBLEM TO BE SOLVED: To provide a component built-in type multilayer board which is suitable for building components of different heights therein. SOLUTION: A metal core layer formed by bonding metal layers 30-1 and 30-2 is used to build the components of different heights therein. The metal core l...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SARUWATARI TATSURO, MIYAZAKI MASASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a component built-in type multilayer board which is suitable for building components of different heights therein. SOLUTION: A metal core layer formed by bonding metal layers 30-1 and 30-2 is used to build the components of different heights therein. The metal core layer is formed therein with through-holes 40-2, 40-3 and a counter sinking 42, which have passive components 20-1, 20-2 and an active component 22 located therein respectively. These components are connected to a wiring pattern 50 formed on wiring layers 34-1, 34-2 via a connection via 52. The contact faces of the components to the connection vias are set at the same height by the two metal layers. COPYRIGHT: (C)2006,JPO&NCIPI