MULTILAYER INTERCONNECTION BOARD

PROBLEM TO BE SOLVED: To provide the configuration of a multilayer interconnection board having a connection layer for setting a base metal as entire or partial materials rather than base metals, such as gold and silver. SOLUTION: In the multilayer interconnection board 3, at least two layers of conductive layers are laminated via a bump 2. The bump 2 and a metal pattern 2 in the conductive layer are connected by a connection layer 1, in a state of alloy with one or both of tin 11, tin and gold, and silver, especially the tin 11 being plated to one of the bump 2 and the metal pattern 2, one or both 12 of gold and silver being plated to the other; and the bump 2 and the metal pattern 2 are subjected to thermocompression bonding for forming the connection layer 1 in a state of alloy, or plating is made by the alloy of one or both of tin and gold, and silver to both of the bump 2 and the metal pattern 2, and the bump 2 and the metal pattern 2 are subjected to thermocompression bonding for improved advantages in the manufacturing costs. COPYRIGHT: (C)2006,JPO&NCIPI