MULTILAYER INTERCONNECTION BOARD

PROBLEM TO BE SOLVED: To provide the configuration of a multilayer interconnection board having mechanical strength, in which the connection layer of bump and metal pattern is strong. SOLUTION: In the multilayer interconnection board 3, at least two layers of conductive layers are laminated via a bump. A connection layer 1, between a bump 2 and a metal pattern 2 in the conductive layer, has strong mechanical hardness, based on the plating of one or both 11 of gold and silver to one of the bump 2 and the metal pattern 2; and the plating of one or both 12 of platinum and palladium to the other and the thermocompression bonding of both of them is made for forming the alloy state between one or both of gold and silver, and one or both of platinum and palladium, or based on the plating of an alloy between one or both of gold and silver and one or both of platinum and palladium to both of the bump 2 and the metal pattern 2, in advance, and then the thermocompression bonding of the bump 2 and the metal pattern 2. COPYRIGHT: (C)2006,JPO&NCIPI