ELEMENT FORMING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an element forming board, capable of suppressing reliability deterioration for a jointed part in the element forming board provided with the structure for sealing the element, and to provide its manufacturing method. SOLUTION: The semiconductor device 1 is provided w...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OKAYAMA YOSHIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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