ELEMENT FORMING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an element forming board, capable of suppressing reliability deterioration for a jointed part in the element forming board provided with the structure for sealing the element, and to provide its manufacturing method. SOLUTION: The semiconductor device 1 is provided with the device part 2, and the device part 2 comprises a semiconductor substrate 3 formed of an element 4, wiring 6a-6c for connecting the element 4 and pads 5a-5c, and a dummy wiring 7. Moreover, the semiconductor device 1 is provided with a cap 8 for covering and sealing the element 4. The dummy wiring 7 reduces the level difference, formed in the part for the jointing part to which the cap 8 is jointed, and formed with wiring 6a-6c on the semiconductor substrate 3 at the part for the jointing part. COPYRIGHT: (C)2006,JPO&NCIPI