PHOTOSENSITIVE POLYMER COMPOSITION, METHOD FOR MANUFACTURING RELIEF PATTERN BY USING THE SAME, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a photosensitive polymer composition which suppresses production of a metal salt and shows a rust prevention effect on a metal layer, a prevention effect against ion migration and improvement in the adhesion with a substrate, to provide a method for manufacturing a r...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAZAKI NORIYUKI, KANETANI YUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive polymer composition which suppresses production of a metal salt and shows a rust prevention effect on a metal layer, a prevention effect against ion migration and improvement in the adhesion with a substrate, to provide a method for manufacturing a relief pattern by using the composition, and to provide electronic components. SOLUTION: The photosensitive polymer composition comprises: (a) a polyimide precursor or polyimide soluble with an alkali aqueous solution; (b) a compound which generates an acid by light; and (c) a cyclic compound. The method for manufacturing a relief pattern includes steps of applying and drying the above photosensitive polymer composition on a supporting substrate, exposing, developing, and heat treating it. COPYRIGHT: (C)2006,JPO&NCIPI