LAMINATE FOR FORMING WIRING SUBSTRATE, WIRING SUBSTRATE ANS ITS FORMING METHOD

PROBLEM TO BE SOLVED: To provide a laminate for a wiring substrate in which adhesiveness is made superior, electric resistance is made low, an etching speed is fast and etching performance and productivity are made superior, to provide a method to form the wiring substrate by etching the laminate an...

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Bibliographische Detailangaben
1. Verfasser:	HIRUMA TAKEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminate for a wiring substrate in which adhesiveness is made superior, electric resistance is made low, an etching speed is fast and etching performance and productivity are made superior, to provide a method to form the wiring substrate by etching the laminate and to provide the wiring substrate. SOLUTION: The laminate for forming the wiring substrate is provided with a substrate layer which is formed on a substrate and is made of Mo as a major ingredient and does not include oxygen and/or nitrogen and a conductor layer which is made of Mo as the major ingredient and does not include oxygen and nitrogen. It is desirable to set a total amount of inclusion of oxygen and nitrogen in the substrate layer to be 5 to 50 atom%. COPYRIGHT: (C)2006,JPO&NCIPI