LAMINATE FOR FORMING WIRING SUBSTRATE, WIRING SUBSTRATE AND ITS FORMING METHOD

PROBLEM TO BE SOLVED: To provide a laminate for forming a wiring substrate in which electric resistance is made low, patterning performance and moisture/heat resistance are made superior, to provide a method to form the wiring substrate by etching the laminate and to provide the wiring substrate. SOLUTION: The laminate for forming the wiring substrate is provided with a conductor layer which is formed on a substrate, a cap layer which is formed on the conductor layer and includes Ni and an Ni diffusion preventing layer which is made between the conductor layer and the cap layer and does not include Ni. The laminate for forming the wiring substrate is provided with a conductor layer which is formed on a substrate, a substrate layer which isformed under the conductor layer and includes Ni and an Ni diffusion preventing layer which is arranged between the conductor layer and the substrate layer and does not include Ni. COPYRIGHT: (C)2006,JPO&NCIPI