CURING METHOD FOR HEAT CURABLE RESIN

PROBLEM TO BE SOLVED: To provide a curing method for a heat curable resin capable of suppressing the generation of volatile organic chemical substances (VOC) such as formaldehyde at the time of curing, and further capable of reducing the residual amount of monomers such as styrene in the cured produ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ICHIKAWA HIDEJI, KOJIMA TATSUIE, NISHIKAWA TORU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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