CURING METHOD FOR HEAT CURABLE RESIN

PROBLEM TO BE SOLVED: To provide a curing method for a heat curable resin capable of suppressing the generation of volatile organic chemical substances (VOC) such as formaldehyde at the time of curing, and further capable of reducing the residual amount of monomers such as styrene in the cured produ...

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Hauptverfasser:	ICHIKAWA HIDEJI, KOJIMA TATSUIE, NISHIKAWA TORU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curing method for a heat curable resin capable of suppressing the generation of volatile organic chemical substances (VOC) such as formaldehyde at the time of curing, and further capable of reducing the residual amount of monomers such as styrene in the cured product, while maintaining the curing characteristics of the heat curable resin. SOLUTION: This curing method for a heat curable resin is characterized by adding 0.01-10 pts.wt. of a hydroperoxide and 0.05-5 pts.wt. of acetylacetone against 100 pts.wt. of the heat curable resin and curing it. The curing method for the heat curable resin is characterized by further adding 0.01-10 pts.wt. of a derivative of acetoacetic acid against 100 pts.wt. of the heat curable resin. COPYRIGHT: (C)2006,JPO&NCIPI