LAMINATE FOR FORMING WIRING BOARD, ITS MANUFACTURING METHOD AND WIRING BOARD

PROBLEM TO BE SOLVED: To provide a laminate for forming a wiring board excellent in adhesion and low in resistance, a laminate manufacturing method, and the highly detailed wiring board of high reliability obtained from the laminate. SOLUTION: The laminate for forming the wiring board is constituted...

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Bibliographische Detailangaben
1. Verfasser:	HIRUMA TAKEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminate for forming a wiring board excellent in adhesion and low in resistance, a laminate manufacturing method, and the highly detailed wiring board of high reliability obtained from the laminate. SOLUTION: The laminate for forming the wiring board is constituted so that a substrate layer based on an Ni-Mo alloy and a conductor layer based on Al or an Al alloy are probided on a substrate and the substrate layer contains oxygen and/or nitrogen. The manufacturing method of the laminate by a sputtering method and the wiring board formed by etching the laminate are also disclosed. COPYRIGHT: (C)2006,JPO&NCIPI