ELECTRONIC PARTS MOUNTER, MANUFACTURING METHOD THEREOF, AND CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an electronic parts mounter capable of withstanding hierarchical mounting in electronic parts mounters for mounting electronic parts, by using a conductive adhesive. SOLUTION: The electronic parts mounter is provided with wiring electrodes 9, external electrodes 2, 3...

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Bibliographische Detailangaben
Hauptverfasser:	KITAE TAKASHI, NAKATANI SEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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