ELECTRONIC PARTS MOUNTER, MANUFACTURING METHOD THEREOF, AND CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an electronic parts mounter capable of withstanding hierarchical mounting in electronic parts mounters for mounting electronic parts, by using a conductive adhesive. SOLUTION: The electronic parts mounter is provided with wiring electrodes 9, external electrodes 2, 3...

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Bibliographische Detailangaben
Hauptverfasser: KITAE TAKASHI, NAKATANI SEIICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic parts mounter capable of withstanding hierarchical mounting in electronic parts mounters for mounting electronic parts, by using a conductive adhesive. SOLUTION: The electronic parts mounter is provided with wiring electrodes 9, external electrodes 2, 3 of electronic parts, and a conductive adhesive 4 having a resin 7 and a conductive filler 8 as main components and connecting to the wiring electrodes 9 and the external electrodes 2, 3 electrically. The conductive filler 8 has at least two or more kinds of metal. At least some parts of the surfaces of a core layer 6 formed of a first metal are covered with a second metal 5 that is different from the first metal 6. The rate of solution of the first metal 6 to the molten state of the metal forming the outermost layer of the external electrode 2 is made slower than the rate of solution of the second metal 5 to the molten state. COPYRIGHT: (C)2006,JPO&NCIPI